物料種類
Material
|
鍍覆材料
Coating Metal
|
粒度範圍
Size |
電鍍百分比
Coating per%
|
|
Cu / Ni |
30 / 40 - 325 / 400 |
5%,
10%, 15%, 30%
50%, 55%, 56%, 60% |
樹脂金剛石
Resin bond diamond |
Cu / Ni |
60 / 70 - 325 / 400 |
5%, 10%,
15%, 30%
50%, 55%, 56%, 60% |
CBN料
CBN |
Cu / Ni |
|
5%, 10%,
15%, 30%
50%, 55%, 56%, 60% |
|
|
|